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1 copyright ? 2010, everlight all rights reserved. release date : 10.06.2011. issue no: dhe-0000991 www.everlight.com ehp-c04/nt01h-p01/tr received mass production preliminary customer design device no. : dhe-0000991 page : 12 revised record rev. description release date 1 new spec 2011.03.09 2 change format 2011.03.31 3 1. change color binning 2. change typical electro-optical characteristics curves 2010.08.06 4 change luminous flux binning 2010.09.06 5 1.change format 2.change iv cct vf bin 3.change package dimension 4.change carrier tape dimensions 2011.10.06
datasheet ehp-c04/nt01h-p01/tr 2 copyright ? 2010, everlight all rights reserved. release date : 10.06.2011. issue no: dhe-0000991 www.everlight.com ehp-c04/nt01h-p01/tr mass prodution features z small & compact package and with high efficiency z typical luminous flux: 85 lm @500ma z typical color temper ature: 5700 k@500ma z optical efficiency@500ma : 47 lm/w z esd protection up to 8kv z moisture sensitivity level (msl) class 1 z grouping parameter: total luminous flux, color coordinates. z rohs compliant & pb free. a pplications z mobile phone camera flash(camera flash light /strobe light for mobile devices ) z torch light for dv(digital video) application z indoor lighting applications z signal and symbol luminaries for orientation maker lights (e.g. steps, exit ways, etc.) z tft backlighting z exterior and interior illumination applications z decorative and entertainment lighting z exterior and interior automotive illumination
datasheet ehp-c04/nt01h-p01/tr 3 copyright ? 2010, everlight all rights reserved. release date : 10.06.2011. issue no: dhe-0000991 www.everlight.com device selection guide chip materials emitted color ingan white a bsolute maximum ratings (t solder pad =25 ) parameter symbol rating unit dc forward current (ma) i f 350 ma peak pulse current (ma) (400ms : on 3600ms : off) i pulse 1500 ma esd resistance v b 8000 v reverse voltage v r [1] v junction temperature t j 125 operating temperature t opr -40 ~ +85 storage temperature t stg -40 ~ +110 power dissipation (pulse mode) p d 7.5 w soldering temperature t sol 260 allowable reflow cycles n/a 2 cycles viewing angle (2) 2 1/2 130 deg note: 1. the c04 series leds are not designed for reverse bias used. 2. view angle tolerance is 5 . 3. avoid operating c04 series leds at ma ximum operating temperature exceed 1 hour. 4. all specification are assure d by reliability test for 1000hr, iv degradation less than 30%. 5. all reliability ite ms are tested under good thermal management with 1.0x 1.0 cm 2 mcpcb. 6. peak pulse current shall be applied under conditi ons as max duration time 400ms and max duty cycle 10%. 7. operate led component at maximum rating conditions continuously will cause possible permanent damage and de-rating parameter s. exercise multiple maximum rating parameters simultaneously should not be allowed. when maximum rating parameters are applied ov er a long period will result pote ntial reliability issue.
datasheet ehp-c04/nt01h-p01/tr 4 copyright ? 2010, everlight all rights reserved. release date : 10.06.2011. issue no: dhe-0000991 www.everlight.com jedec moisture sensitivity level floor life soak requirements standard time (hours) conditions time (hours) conditions 1 unlimited Q 30 / 85% rh 168(+5/-0) 85 / 85 rh electro-optical characteristics (t solder p ad =25oc) parameter symbol min. typ. max. unit condition luminous flux (1) v 70 85 ---- lm i f =500ma forward voltage (2) (3) v f 2.95 ---- 4.15 v correlated color temperature cct 4500 ---- 7000 k note: 1. luminous flux measur ement tolerance: 10%. 2. forward voltage measur ement tolerance: 0.1v. 3. electric and optical data is tested at 50 ms pulse condition. bin ran g e of forward voltage binning bin code min. typ. max. unit condition 2932 2.95 ---- 3.25 v i f =500ma 3235 3.25 ---- 3.55 3538 3.55 ---- 3.85 3841 3.85 ---- 4.15 bin ran g e of luminous intensit y bin code min. typ. max. unit condition f7 70 ---- 80 lm i f =500ma f8 80 ---- 90 f9 90 ---- 100 j1 100 ---- 120 j2 120 ---- 140 j3 140 ---- 160
datasheet ehp-c04/nt01h-p01/tr 5 copyright ? 2010, everlight all rights reserved. release date : 10.06.2011. issue no: dhe-0000991 www.everlight.com w hite bin structure 0.27 0.30 0.33 0.36 0.39 0.42 0.45 0.27 0.30 0.33 0.36 0.39 0.42 0.45 (3) (2) (1) 4500 5000 5700 7000 y x notes 1.color bin (1) :4550k 2.color bin (2) :5057k 3.color bin (3) :5770k w hite bin coordinate bin cie-x cie-y cct reference range 4550 0.3738 0.4378 4500k ~ 5000k 0.3524 0.4061 0.3440 0.3420 0.3620 0.3720 5057 0.3300 0.3200 5000k ~ 5700k 0.3300 0.3730 0.3440 0.3420 0.3524 0.4061 5770 0.3030 0.3330 5700k ~ 7000k 0.3300 0.3730 0.3300 0.3200 0.3110 0.2920 note: 1.color coordinates measurem ent allowance : 0.01 . 2.color bins are defined at i f =500ma and 50ms pulse operation condition.
datasheet ehp-c04/nt01h-p01/tr 6 copyright ? 2010, everlight all rights reserved. release date : 10.06.2011. issue no: dhe-0000991 www.everlight.com t y pical electro-optical characteristics curves relative spectral distribution, i f =500ma@50ms, t solder pad =25 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 wavelength(nm ) relative intensity(a.u.) typical radiation patterns typical po lar radiation patt ern for lambertian relativety luminous intensity -90 -60 -30 0 30 60 90 0.0 0.2 0.4 0.6 0.8 1.0 relative intensity(a.u.) 2q (degree) x axis y axis 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.0 -90 -75 -60 -15 -45 -30 90 30 75 60 45 15 0 degree note: 1.2 1/2 is the off axis angle from lamp centerline where th e luminous intensity is 1/2 of the peak value. 2.view angle tolerance is 5 .
datasheet ehp-c04/nt01h-p01/tr 7 copyright ? 2010, everlight all rights reserved. release date : 10.06.2011. issue no: dhe-0000991 www.everlight.com forward voltage vs forward current, t solde r p ad =25oc correlated color temperature(cct) vs. forward current 0 250 500 750 1000 1250 1500 2.8 3.2 3.6 4.0 4.4 4.8 5.2 forward voltage(v) forward current(ma@50ms) 0 250 500 750 1000 1250 1500 5500 5600 5700 5800 5900 6000 correlated color temperatrue(k) forward current(ma@50ms) luminous flux vs forward current, t solder pad =25oc forward current derating curve, derating based on t j max =125c at torch mode 0 250 500 750 1000 1250 1500 0.0 0.5 1.0 1.5 2.0 forward current(ma@50ms) relative luminous flux(lm) 0255075100 0 100 200 300 400 500 600 solder temperature ( o c ) forward current (ma) note: 1. all correlation data is tested unde r superior thermal management with 1.0x 1.0 cm 2 mcpcb
datasheet ehp-c04/nt01h-p01/tr 8 copyright ? 2010, everlight all rights reserved. release date : 10.06.2011. issue no: dhe-0000991 www.everlight.com packa g e dimension chip position top view anode pad cathode pad 0,5 1,1 1,45 0,25 0,125 optical center 2,04 1,64 optical center 0.75 0 .3 -0.0 5/+0 0.3 1,64 note: 1.dimensions are in millimeters. 2.tolerances unless mentioned are 0.1mm.
datasheet ehp-c04/nt01h-p01/tr 9 copyright ? 2010, everlight all rights reserved. release date : 10.06.2011. issue no: dhe-0000991 www.everlight.com moisture resistant packin g materials label explanation ? cpn: customer specification (when required) ? p/n: everlight production number ? qty: packing quantity ? cat: luminous flux (brightness) bin ? hue: color bin ? ref: forward voltage bin ? lot no: lot number carrier tape dimensions: loaded quantit y 2000 pcs per reel polarity progress direction note: 1.dimensions are in millimeters. 2.tolerances unless mentioned are 0.1mm.
datasheet ehp-c04/nt01h-p01/tr 10 copyright ? 2010, everlight all rights reserved. release date : 10.06.2011. issue no: dhe-0000991 www.everlight.com reel dimensions note: 1.dimensions are in millimeters. moisture resistant packin g process
datasheet ehp-c04/nt01h-p01/tr 11 copyright ? 2010, everlight all rights reserved. release date : 10.06.2011. issue no: dhe-0000991 www.everlight.com reflow solderin g characteristics solderin g and handlin g 1. over-current-proof though ehp-c04 series has conducted esd protection mechanism, customers must not use the device in reverse and should apply resistors for extra protection. otherwise, slight voltage shift may cause enormous current shift and burn out failure wou ld happen 2. storage i. do not open the moisture-proof bag before the products are ready to use. ii. before opening the package, the leds should be stored at temperature less than 30 c and less and relative humidity less than 90%. iii. after opening the package, the leds should be stored at temperature less than 30 c and relative humidity less than 85%. iv. if the moisture absorbent material (silicone gel) has fade d away or the leds have exceeded the storage time, baking treatment should be implemented based on the following conditions: pre-curing at 605 c for 24 hours. 3. thermal management i. for maintaining the high flux output and achieving reliab ility, ehp-c04 series leds shou ld be mounted on a metal core printed circuit board (mcpcb), with proper thermal connection to dissipate approximately 1w to 5w of thermal energy under normal operation. ii. sufficient thermal management must be conducted, or the die junction temperat ure will be over the limit under large electronic driving and leds lif etime will decrease critically iii. when operating , the solder pad temper ature ( or the board temperature nearby the led) must be controlled under 70 . 4. soldering condition 4.1 soldering pad
datasheet ehp-c04/nt01h-p01/tr 12 copyright ? 2010, everlight all rights reserved. release date : 10.06.2011. issue no: dhe-0000991 www.everlight.com 4.2 for reflow process i. lead reflow soldering temperature profile ii. reflow soldering should not be done more than two times. i ii. while soldering, do not put stress on the leds during heating. iv. after soldering, do not warp the circuit board.

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